We have some of the very latest pick and place equipment, capable of placing components from 01005 up to 100x100mm. We also have manual placement facilities for prototype and small batch quantities and vapour phase reflow and complement this with a range of additional services including;
- Manual placement facilities for prototypes and small batch quantities
- Fully automatic wire cutting and stripping
- Crimping and wire ident marking
- Cable looming and lacing
- Panel and control box wiring
- Hot air re-work and component harvesting
- Component re-balling
- Manual soldering
- Fully automatic selective soldering
- Wave soldering
- Automated lead cropping
- AOI inspection
- Testing
- Conformal coating
- Final box build
- Packaging
- Circuit Board Layout
- Electronic Design/Design for Manufacture
- Software design
- Board serialisation
- Material procurement & hard to find part searches